2013 MRQW Proceedings

Corporate Staff
posted January 29, 2014

Microelectronics Reliability and Qualification Working Meeting

MRQW FINAL LOGO bwDecember 10 & 11, 2013—The Aerospace Corporation, El Segundo, Calif.

MRQW provides a forum for discussing issues in all areas of microelectronics reliability and qualification for high-reliability and commercial applications. Technical sessions and keynote speakers cover the latest results or work in progress in microelectronics devices.

Combined presentations may be downloaded by clicking here.

Presentations not linked are not available. All documents are posted with permission.

Tuesday, December 10

  • Welcoming Remarks and Overview of the Technical Program – Ronald Lacoe, General Chair and Technical Program Chair, The Aerospace Corporation

Session I: BME Capacitors

Chair: Marco Garcia, The Aerospace Corporation

  • Analysis of Accelerated Life Test for BME Capacitors – Doug Sheldon, Jet Propulsion Laboratory

Session II: Optoelectronics

Chair: Maribeth Mason, The Aerospace Corporation

Session III: Government Programs

Chair: Donald Dorsey, Air Force Research Laboratory, Materials and Manufacturing Directorate

  • Report on the “DRIFT” ONR MURI – Umesh Mishra, University of California, Santa Barbara
  • Overview of the AFRL Space Electronics Technology Program – Bob Pugh, Think Strategically/Air Force Research Laboratory, Space Vehicles Directorate

Session IV: Packaging

Chair: Bob Pugh, Think Strategically/Air Force Research Laboratory, Space Vehicles Directorate

Session V: Emerging Technologies: CNT and Graphene Microelectronics

Chair: Adam Bushmaker, The Aerospace Corporation

Wednesday, December 11

Session VI: Device Reliability

Chair: Daniel Marrujo, DMEA

Session VII: Rad-Hard ASIC Suppliers

Chair: Dave Eccles, The Aerospace Corporation

  • Radiation-Hardening by Design Phase 3 – Tony Amort, The Boeing Company

Session VIII: Memories

Chair: Doug Sheldon, Jet Propulsion Laboratory

Session IX: Radiation Effects and FPGAs

Chair: Jon Osborn, The Aerospace Corporation

  • SEE Results from 32nm RHBD Program – Ethan Cannon, The Boeing Company